5G Workshop between Regional Initiatives, EU ICT Lisbon conference, Oct 2015

Agenda

9:15–10:00	Welcome address: Mr Zoran STANCIC, Deputy Director General, DG CONNECT, EC Key note address, Guenther H. OETTINGER, Commissioner for the Digital Economy and Society “5G International Cooperation, Priorities and expectations” Position Statements on 5G International Cooperation by invited Administrations of China, Japan, Republic of Korea, USA (5mn each) Launch of Multi Lateral MoU by Industrial Association and Fora Group Photos
	Session 1, Standards. The session will address 5G standardisation from the perspective of governments and related industrial associations and fora.
10:00-11:15	The government perspective. This panel addresses the standardisation priorities, milestones and approach from the perspective of public administrations. Moderator: Mr. David Kennedy, Director Eurescom, Lead EURO 5G. Panelists – Mr. Dong Xiao Lu, Director, MIIT (CN); – Mr. Yuji Nakamura, Director, MIC (JP); – Mr. Juseop Sim, Deputy Director, MSIP (RoK); – Mr. Robert Nelson, Chief Engineer, FCC International Bureau (US); – Mr. Bernard Barani, Deputy Head of Unit, EC Format: max 10 mn position statement by panelists followed by interactive discussion
11:35-13:00	The perspective from industrial associations. Standardisation priorities, milestones and approach from the perspective of industrial associations and actors, including ways to foster cooperation on standards across the various initiatives and to operationalise the MoU’s that have been signed between those. Moderator: Mr. Hans van der Veen, Chief standardisation, NEC Europe Panelists – Dr. Hugo Tullberg, Ericsson, 5G-Infrastructure-Association, pre standardisation chair; – Dr. Kohei Satoh, ARIB, Secretary General of 5GMF; – Prof. HyeonWoo Lee, Chair of Global Strategy Sub-Committee, 5G Forum – Dr. Hakan Andersson, Ericsson-4GAmericas; – Mrs. Wang Zhiqin, CAICT, Secretary General of IMT 2020 (5G) Promotion Group. Format: max 10 mn position statement by panelists followed by interactive discussion
	Session 2, Spectrum. The session will address the various 5G spectrum related issues from the perspective of governments and related industrial associations and fora.
14:00-15:20	The government perspective. This panel addresses the 5G spectrum priorities, milestones and approach from the perspective of public administrations. Moderator: Dr. Branimir Stantchev, EC Spectrum Policy Panelists – Mr. Dong Xiao Lu, Director, MIIT (CN); – Mr. Yuji Nakamura, Director, MIC (JP); – Mr. Juseop Sim, Deputy Director, MSIP (RoK); – Mr. Robert Nelson, Chief Engineer, FCC International Bureau (US); – Mr. Eric Fournier, ECC Chairman. Format: max 10 mn position statement by panelists followed by interactive discussion
15:40-17:00	The perspective from industrial associations. This panel addresses the 5G spectrum priorities, milestones and approach from the erspective of industrial associations and actors, including ways to foster cooperation on spectrum matters across the various initiatives and to operationalise the MoU’s that have been signed between those. Moderator: Mr. Ulrich Rehfuess, Chair Digital Europe Spectrum Working Group Panelists – Dr. Terje Tjelta, Telenor, 5G-I-A spectrum chair; – Mr. Takehiro Nakamura, Acting Chair of Strategy & Planning Committee, 5GMF; – Prof. DongKu Kim, Vice-Chair of Steering Committee, 5G Forum – Dr. Hakan Andersson, Ericsson-4GAmericas; – Mrs. Wang Zhiqin CAICT, Secretary General of IMT 2020 (5G) Promotion Group. Format: max 10 mn position statement by panelists followed by interactive discussion
17:00-18:15	Concluding Panel: summary and conclusions, towards a global 5G vision and collaboration, the way forward. Chair: Mr. Klaus Moschner, Senior Manager, NGMN 5 to 10 mn (max) statements from industrial actors of the 5 invited regions (EU, CN, USA, RoK, JP) providing their summary views on the discussions of the workshop, priorities for international cooperation in standards and spectrum, and key recommendations towards public authorities. Panelists: – Alistair Urie, Alcatel-Lucent; – Alin Stanescu, Qualcomm; – Hans van der Veen, NEC; – Maziar Nekovee, Samsung; – Jan Johansson, ZTE